(footprint CONV_RP10-4812SE (layer F.Cu) (tedit 698DEA26)
  (descr "")
  (fp_text reference REF** (at -22.225 -14.605 0) (layer F.SilkS))
  (fp_text value CONV_RP10-4812SE (at -15.24 14.605 0) (layer F.Fab))
  (pad 1 thru_hole rect (at -10.2 2.54) (size 2.175 2.175) (drill 1.45) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at -10.2 -2.54) (size 2.175 2.175) (drill 1.45) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 6 thru_hole circle (at -10.2 -10.16) (size 2.175 2.175) (drill 1.45) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 5 thru_hole circle (at 10.12 -10.16) (size 2.175 2.175) (drill 1.45) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at 10.12 10.16) (size 2.175 2.175) (drill 1.45) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)