(module CAPPRD500W60D1250H2650 (layer F.Cu) (tedit 65B71E75)
  (descr "")
  (fp_text reference REF** (at -0.079 -7.889 0) (layer F.SilkS))
  (fp_text value CAPPRD500W60D1250H2650 (at 10.716 7.389 0) (layer F.Fab))
  (pad P thru_hole rect (at -2.5 0.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad N thru_hole circle (at 2.5 0.0) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)