(module CAPPRD500W50D500H1100 (layer F.Cu) (tedit 656D5262)
  (descr "")
  (fp_text reference REF** (at 0.2892 -4.548 0) (layer F.SilkS))
  (fp_text value CAPPRD500W50D500H1100 (at 10.4492 4.528 0) (layer F.Fab))
  (pad P thru_hole rect (at -2.5 0.0) (size 1.1 1.1) (drill 0.75) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad N thru_hole circle (at 2.5 0.0) (size 1.1 1.1) (drill 0.75) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)