(module CAPPRD200W50D500H1100 (layer F.Cu) (tedit 68A68E35)
  (descr "")
  (fp_text reference REF** (at 0.8833 -3.835 0) (layer F.SilkS)
    (effects (font (size 1.0 1.0) (thickness 0.15)))
  )
  (fp_text value CAPPRD200W50D500H1100 (at 11.0433 3.815 0) (layer F.Fab)
    (effects (font (size 1.0 1.0) (thickness 0.15)))
  )
  (pad P thru_hole rect (at -1.0 0.0) (size 1.1 1.1) (drill 0.75) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad N thru_hole circle (at 1.0 0.0) (size 1.1 1.1) (drill 0.75) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (fp_circle (center 0.0 0.0) (end 2.5 0.0) (layer F.Fab) (width 0.127))
  (fp_circle (center 0.0 0.0) (end 2.5 0.0) (layer F.SilkS) (width 0.127))
  (fp_circle (center 0.0 0.0) (end 2.75 0.0) (layer F.CrtYd) (width 0.05))
  (fp_circle (center -3.25 0.0) (end -3.15 0.0) (layer F.SilkS) (width 0.2))
  (fp_circle (center -3.25 0.0) (end -3.15 0.0) (layer F.Fab) (width 0.2))
)