(footprint CAPC1005X33N (layer F.Cu) (tedit 671C4027)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.3 -0.88 0) (layer F.SilkS))
  (fp_text value CAPC1005X33N (at 2.05 0.88 0) (layer F.Fab))
  (pad 1 smd rect (at -0.437 0.0) (size 0.53 0.6) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
  (pad 2 smd rect (at 0.437 0.0) (size 0.53 0.6) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
)