(module BLACKSWIFT_CONNECTORS_TC2030-IDC-NL (layer F.Cu) (tedit 660D9885)
  (descr "")
  (attr smd)
  (fp_text reference REF** (at 0.0 2.54 0) (layer F.SilkS))
  (fp_text value "BLACKSWIFT_CONNECTORS_TC2030-IDC-NL" (at 0 0) (layer F.Fab))
  (pad 1 smd circle (at -1.27 0.635) (size 0.7874 0.7874) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 2 smd circle (at -1.27 -0.635) (size 0.7874 0.7874) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 3 smd circle (at 0.0 0.635) (size 0.7874 0.7874) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 4 smd circle (at 0.0 -0.635) (size 0.7874 0.7874) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 5 smd circle (at 1.27 0.635) (size 0.7874 0.7874) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad 6 smd circle (at 1.27 -0.635) (size 0.7874 0.7874) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
  (pad None np_thru_hole circle (at -2.54 0.0) (size 0.9906 0.9906) (drill 0.9906) (layers *.Cu *.Mask))
  (pad None np_thru_hole circle (at 2.54 -1.016) (size 0.9906 0.9906) (drill 0.9906) (layers *.Cu *.Mask))
  (pad None np_thru_hole circle (at 2.54 1.016) (size 0.9906 0.9906) (drill 0.9906) (layers *.Cu *.Mask))
)