(module BGA6C50P2X3_96X146X62 (layer F.Cu) (tedit 6451C6B8)
  (descr "WLCSP6 1.46x0.96x0.582 CASE 567RM ISSUE O")
  (tags "Integrated Circuit")
  (attr smd)
  (fp_text reference IC** (at 0.02032 -2.42316) (layer F.SilkS))
  (fp_text value BGA6C50P2X3_96X146X62 (at -0.15748 3.556) (layer F.SilkS) hide)
  (pad A1 smd circle (at -0.25 -0.5 90) (size 0.302 0.302) (layers F.Cu F.Paste F.Mask))
  (pad A2 smd circle (at 0.25 -0.5 90) (size 0.302 0.302) (layers F.Cu F.Paste F.Mask))
  (pad B1 smd circle (at -0.25 0 90) (size 0.302 0.302) (layers F.Cu F.Paste F.Mask))
  (pad B2 smd circle (at 0.25 0 90) (size 0.302 0.302) (layers F.Cu F.Paste F.Mask))
  (pad C1 smd circle (at -0.25 0.5 90) (size 0.302 0.302) (layers F.Cu F.Paste F.Mask))
  (pad C2 smd circle (at 0.25 0.5 90) (size 0.302 0.302) (layers F.Cu F.Paste F.Mask))
  (model FPF1320UCX.stp
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
