(module AMPHENOL_ACJMIH (layer F.Cu) (tedit 654D620F)
  (descr "")
  (fp_text reference REF** (at -6.985 15.875 0) (layer F.SilkS))
  (fp_text value AMPHENOL_ACJMIH (at -0.635 17.653 0) (layer F.Fab))
  (pad T thru_hole circle (at -8.15 6.25) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad TN thru_hole circle (at 8.15 6.25) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad R thru_hole circle (at -8.15 0.0) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad RN thru_hole circle (at 8.15 0.0) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad S thru_hole circle (at -8.15 -6.25) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad SN thru_hole circle (at 8.15 -6.25) (size 2.25 2.25) (drill 1.5) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (fp_text user "PCB Edge" (at 11.335 -10.854) (layer F.Fab))
)